MFX3: Reflow and Soldering Technology: Challenges

Date & Time

Sep 28th at 8:00 AM until 9:30 AM


Manufacturing Excellence (MFX) 


Rating ( votes)

Session MFX3 - Reflow and Soldering Technology: Challenges
Chair: Chrys Shea, Shea Engineering
Co-Chair: Jeff Kennedy, Celestica Inc.

Utilization of Lead-free Ball Grid Arrays In a Tin/Lead Soldering Process
*David Hillman, Rockwell Collins

A Unique Heating/Reflow Technique to Minimize Solder Paste Induced Voiding Under LEDs
Derrick Herron, Indium Corporation; John Mathurin and Charlie Wilkinson, Ansen Corporation

Oxygen Doping or Closed Loop Controlled Nitrogen in Reflow Oven
Gerjan Diepstraten, Vitronics Soltec B.V.