FSA5: Solder - Part 2

Date & Time

Sep 28th at 4:00 PM until 5:30 PM


Flux, Solder, Adhesives (FSA) 


Rating ( votes)

Session FSA5 - Solder- Part 2
Chair: Dale Lee, Plexus
Co-Chair: Elaina Zito, Indium Coporation

Wetting and Solidification of of Pure Tin on Polycrystalline Intermetallic Cux Aly Substrates
Kathlene Reeve and Carol A. Handwerkewerker, Ph.D., Purdue University

Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste For Large Pads
Li Ma, Fen Chen, and *Ning-Cheng Lee, Ph.D., Indium Corporation

Project Update : Protocol Development for Testing Solder Reliability in Combined Environments
*John McMahon, P.E., *Polina Snugovsky and Jeffrey Kennedy, Celestica, Inc.; Joseph Juarez and Milea Kammer, Honeywell; Ivan Straznicky, Curtiss Wright; David Hillman, and David Adams, Rockwell Collins; Stephan Meschter, Ph.D., BAE Systems, Doug Perovic, University of Toronto; Subramanuim Suthakaran and Russell Brush, Celestica, Inc.