Session MFX7 - Cleaning: New Techniques
Chair: Jason Keeping, P.E., Celestica Inc.
Co-Chair: Eric Camden, Foresite, Inc.
Ultrasonics as an Option for Electronics Assembly Cleaning
Barbara Kanegsberg and Ed Kanegsberg, BFK Solutions LLC
BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes
*Mike Bixenman, DBA, KYZEN Corporation; *Mark McMeen and Jason Tynes, STI Corporation
DfR-Design for Rinse-ability: Effect of SMT Component Package Design on Cleaning Effectiveness
Norman Armendariz, Ph.D., Raytheon Company