SMTA International 2017

If you want to get the latest research to help you reduce defects and control your processes, look no further than the SMTA International Technical Conference. Choose from four days of session tracks including Advanced Packaging Technology; Flux, Solder, Adhesives; Inspection Technologies; Manufacturing Excellence; and Substrates/PCB Technology, as well as the Harsh Enivronments Symposium, Technical Innovations Symposium, and the Lead-Free Soldering Technology Symposium. Microsoft Corporation's Rune Jensen will keynote Tuesday morning with his presentation "Experiencing Mixed Reality - using the Microsoft HoloLens." Twenty half-day educational workshops are offered Sunday and Monday from expert instructors on topics including Fan-Out Wafer-Level Packaging and 3D Packaging, DfX, Cleaning, Ball Grid Array (BGA) issues, Flex Circuits, Reliability, Inspection, Temperature Profiling, Reflow Soldering, Stencil Printing, Surface Finishes, Process Troubleshooting and more.